By D. A. Beck (auth.), Gerald A. Walker (eds.)
Read or Download Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado PDF
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Additional info for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Surface resistance. min.. meg-cm. Water absorption, average. max.. % Dielectric breakdown (parallel to laminations). average, min. lev: Step-by-step test Dielectric constant average max.. at 1 Mc Dissipation factor. average. max.. at 1 Mc Flexural strength, average. min.. psi: Lengthwise Crosswise Arc resistance. average, min.. 800 22,000 0-48/5D+0-1/2f23 60 97 resonances. Typical reductions in magnification at resonance run about 3 to 1 for most usual board constructions. 5 g peak input if damped.
Plunkett, Editor, "Colloquium on Mechanical Impedance Methods for Mechanical Vibrations,· Trans. ASME (Dec. 2, 1958).  G. W. Painter and B. W. 3, Project 01783.  R. P. Thorn, "Controlling Structural Response of Electronic Chassis," First Intern. Electronic Circuit Packaging Symposium Papers.  B. W. Campbell, "Elastomers Applied to Structural Damping,· ASME Paper No. 60-RP-19 (October 9-12, 1960). DISCUSSION Que s t ion: Herb Flatto, Hughes, Fullerton. Have you made any investigation into controlling the response of welded modules with increased component density and potting compounds which in themselves result in damping of the structure?
Input due to a mechanical disturbance or excitation of the vehicle structure. A typical frequency response or transmissibility curve for such a simple system would have a series of peaks as shown in Fig. 3. Note the frequency ranges for elements in the complex system. No effort has been made to consider coupled effects, or the multidegrees of freedom expected in distributed mass systems. The gross complexity of the design problem soon becomes overwhelming. Typical design practices in the industry today suggest that the various natural frequencies of the composite unit be separated as far as possible.